北京快3官网投注平台

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    2. Company profile

       Regarding“Technological Innovation” as the guide, we are dedicated to the development ofadvanced IC assembly technologies. At present, it has been certified onmass-production capability for TSSOP, DFN, QFN ,LGA ,BGA , SiP and FlipChip(except for bumping process) packages, and it is also capable of waferprobing.


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